Algengar SMD pakkningar


 * Two-terminal packages
 * Rectangular passive components (mostly resistors and capacitors):
 * 01005 (0402 metric) : 0.016" &times; 0.008" (0.4 mm &times; 0.2 mm) Typical power rating for resistors 1/32 Watt
 * 0201 (0603 metric) : 0.024" &times; 0.012" (0.6 mm &times; 0.3 mm) Typical power rating for resistors 1/20 Watt
 * 0402 (1005 metric) : 0.04" &times; 0.02" (1.0 mm &times; 0.5 mm) Typical power rating for resistors 1/16 Watt
 * 0603 (1608 metric) : 0.063" &times; 0.031" (1.6 mm &times; 0.8 mm) Typical power rating for resistors 1/16 Watt
 * 0805 (2012 metric) : 0.08" &times; 0.05" (2.0 mm &times; 1.25 mm) Typical power rating for resistors 1/10 or 1/8 Watt
 * 1206 (3216 metric) : 0.126" &times; 0.063" (3.2 mm &times; 1.6 mm) Typical power rating for resistors 1/4 Watt
 * 1806 (4516 metric) : 0.177" &times; 0.063" (4.5 mm &times; 1.6 mm)
 * 1812 (4532 metric) : 0.18" &times; 0.12" (4.5 mm &times; 3.2 mm) Typical power rating for resistors 1/2 Watt
 * 2010 (5025 metric) : 0.2" &times; 0.1" (5.0 mm &times; 2.5 mm)
 * 2512 (6332 metric) : 0.25" &times; 0.12" (6.35 mm &times; 3.0 mm)
 * Tantalum capacitors :
 * EIA 3216-12 (Kemet S, AVX S): 3.2 mm &times; 1.6 mm &times; 1.2 mm
 * EIA 3216-18 (Kemet A, AVX A): 3.2 mm &times; 1.6 mm &times; 1.8 mm
 * EIA 3528-12 (Kemet T, AVX T): 3.5 mm &times; 2.8 mm &times; 1.2 mm
 * EIA 3528-21 (Kemet B, AVX B): 3.5 mm &times; 2.8 mm &times; 2.1 mm
 * EIA 6032-15 (Kemet U, AVX W): 6.0 mm &times; 3.2 mm &times; 1.5 mm
 * EIA 6032-28 (Kemet C, AVX C): 6.0 mm &times; 3.2 mm &times; 2.8 mm
 * EIA 7260-38 (Kemet E, AVX V): 7.2 mm &times; 6.0 mm &times; 3.8 mm
 * EIA 7343-20 (Kemet V, AVX Y): 7.3 mm &times; 4.3 mm &times; 2.0 mm
 * EIA 7343-31 (Kemet D, AVX D): 7.3 mm &times; 4.3 mm &times; 3.1 mm
 * EIA 7343-43 (Kemet X, AVX E): 7.3 mm &times; 4.3 mm &times; 4.3 mm
 * SOD: Small Outline Diode
 * SOD-323: 1.7 &times; 1.25 &times; 0.95 mm
 * SOD-123: 3.68 &times; 1.17 &times; 1.60 mm
 * SOD-80C: 3.50mm &times; 1.50mm &times; More info
 * MELF — Metal Electrode Leadless Face — (mostly resistors and diodes): Barrel shaped components, dimensions do not match those of rectangular references for identical codes.
 * MicroMelf (MMU) Size 0102: L:2.2mm D:1.1mm (solder pad fits rectangular 0805) 	 1/5 Watt (0.2W) 100V
 * MiniMelf (MMA) Size 0204: L:3.6mm D:1.4mm (solder pad fits rectangular 1206)	 1/4 Watt (0.25W) 200V
 * Melf     (MMB) Size 0207: L:5.8mm D:2.2mm                                            1 Watt (1.0W)  500V
 * Three-terminal packages
 * SOT: small-outline transistor, with three terminals
 * SOT-23: 3 mm &times; 1.75 mm &times; 1.3 mm body - three terminals for a transistor, or up to eight terminals for an integrated circuit
 * SOT-223: 6.7 mm &times; 3.7 mm &times; 1.8 mm body - four terminals, one of which is a large heat-transfer pad
 * DPAK (TO-252): discrete packaging. Developed by Motorola to house higher powered devices. Comes in three- or five-terminal versions
 * D2PAK (TO-263) - bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions
 * D3PAK (TO-268) - even larger than D2PAK
 * Packages with four or more terminals (drawings of most of the following packages can be found on )
 * Dual-in-line
 * Small-outline integrated circuit (SOIC) - small-outline integrated circuit, dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm
 * J-Leaded Small Outline Package (SOJ) - the same as SOIC except J-leaded
 * TSOP - thin small-outline package, thinner than SOIC with smaller pin spacing of 0.5 mm
 * SSOP - Shrink Small-Outline Package, pin spacing of 0.635 mm or in some cases 0.8mm
 * TSSOP - Thin Shrink Small-Outline package.
 * QSOP - Quarter-Size Small-Outline package, with pin spacing of 0.635 mm
 * VSOP - Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
 * Quad-in-line
 * PLCC - plastic leaded chip carrier, square, J-lead, pin spacing 1.27 mm
 * QFP - Quad Flat Package, various sizes, with pins on all four sides
 * LQFP - Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
 * PQFP - plastic quad flat-pack, a square with pins on all four sides, 44 or more pins
 * CQFP - ceramic quad flat-pack, similar to PQFP
 * MQFP - Metric Quad Flat Pack, a QFP package with metric pin distribution
 * TQFP - thin quad flat pack, a thinner version of PQFP
 * QFN - quad flat pack, no-leads, smaller footprint than leaded equivalent
 * LCC - Leadless Chip Carrier, contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
 * MLP - Leadframe package with a 0.5 mm contact pitch, no leads
 * PQFN - power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking
 * Grid arrays
 * PGA - Pin grid array.
 * BGA - ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
 * LGA - Same Manufacture process of BGA, has Advantage being cooler than BGA by quick Heat Deception feature. No Balls only Patch.
 * FBGA - fine pitch ball grid array, with a square or rectangular array of solder balls on one surface
 * LFBGA - low profile fine pitch ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
 * TFBGA - thin fine pitch ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
 * CGA - column grid array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
 * CCGA - ceramic column grid array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
 * μBGA - micro-BGA, with ball spacing less than 1 mm
 * LLP - Lead Less Package, a package with metric pin distribution (0.5 mm pitch).
 * Non-packaged devices (although surface mount, these devices require specific process for assembly):
 * COB - chip-on-board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package (usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board.  The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
 * COF - chip-on-flex; a variation of COB, where a chip is mounted directly to a flex circuit.
 * COG - chip-on-glass; a variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD.