Difference between revisions of "Good Vs. Bad Soldering"
From Fab Lab Wiki - by NMÍ Kvikan
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*Be underneath the component and not all over it, ensuring it is connected to the copper and not just sitting in a glob. | *Be underneath the component and not all over it, ensuring it is connected to the copper and not just sitting in a glob. | ||
*Not be a giant glob on the top of the component, not connected to the copper. | *Not be a giant glob on the top of the component, not connected to the copper. | ||
− | *Be very thin so that when heated it will not melt and spread. [[image:P1140121.jpg|175px|thumb| | + | *Be very thin so that when heated it will not melt and spread. [[image:P1140121.jpg|175px|thumb|right|Smooth and thin layer soldered perfectly onto the copper.]] |
*Be small enough so that the clamp is able to clamp directly onto the legs of the component with no troubles from the solder. [[image:P1140126.jpg|175px|thumb|right|The clamp shaped to fit perfectly onto the teeth of the component not covered in solder.]] | *Be small enough so that the clamp is able to clamp directly onto the legs of the component with no troubles from the solder. [[image:P1140126.jpg|175px|thumb|right|The clamp shaped to fit perfectly onto the teeth of the component not covered in solder.]] | ||
==Good Soldering Should Not...== | ==Good Soldering Should Not...== | ||
− | *Be a dull color making it more sponge like and full of holes and harder for electricity to pass through. [[image:P1140119.jpg|175px|thumb| | + | *Be a dull color making it more sponge like and full of holes and harder for electricity to pass through. [[image:P1140119.jpg|175px|thumb|right|A dull, not shiny blob sitting on top of the component.]] |
*Be soldered onto the top of the component, stopping it from connecting to the copper. | *Be soldered onto the top of the component, stopping it from connecting to the copper. | ||
*Be very thick, making it more likely to melt and spread wherever it pleases when heated. | *Be very thick, making it more likely to melt and spread wherever it pleases when heated. | ||
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*Be so underneath as to cause the component to raise up high off of the circuit board. | *Be so underneath as to cause the component to raise up high off of the circuit board. | ||
− | [[Category:Circuits]] | + | [[Category:Circuits]][[Category:Tutorials]] |
Revision as of 11:25, 15 January 2010
- When Soldering you should pay close attention not to ruin the circuit board:
Good Soldering Should...
- Be shiny thus making it less sponge like and more conductive.
- Be underneath the component and not all over it, ensuring it is connected to the copper and not just sitting in a glob.
- Not be a giant glob on the top of the component, not connected to the copper.
- Be very thin so that when heated it will not melt and spread.
- Be small enough so that the clamp is able to clamp directly onto the legs of the component with no troubles from the solder.
Good Soldering Should Not...
- Be a dull color making it more sponge like and full of holes and harder for electricity to pass through.
- Be soldered onto the top of the component, stopping it from connecting to the copper.
- Be very thick, making it more likely to melt and spread wherever it pleases when heated.
- Run over the edges of the copper connecting two parts of copper and shorting out the circuit board.
- Form a bridge between copper pieces, shorting out the board.
- Leave bits of solder lying in random places all over the board.
- Burn the components you are trying to solder on.
- Be so underneath as to cause the component to raise up high off of the circuit board.