|
C Clearance between IC body and PCB
H Total Carrier Height
T Lead Thickness
L Total Carrier Length
LW Lead Width
LL Lead Length
P Pitch
WB IC Body Width
WL Lead-to-Lead Width
O End Overhang
|
Package |
WB |
WL |
H |
C |
L |
P |
LL |
T |
LW |
O
|
SOIC-8 |
4.0 (3.8) |
6.2 (5.8) |
1.75 |
0.25 (0.10) |
5.0 (4.8) |
1.27 |
.41 (1.04) |
.19 (.25) |
.51 (.33) |
.33
|
SOIC-14 |
3.9 |
5.8-6.2 |
1.72 |
0.10-0.25 |
8.55-8.75 |
1.27 |
1.05 |
0.19-0.25 |
0.39-0.46 |
0.3-0.7
|
SOIC-16 |
3.9 |
5.8-6.2 |
1.72 |
0.10-0.25 |
9.9-10 |
1.27 |
1.05 |
0.19-0.25 |
0.39-0.46 |
0.3-0.7
|
SOIC-16 |
7.5 |
10.00-10.65 |
2.65 |
0.10-0.30 |
10.1-10.5 |
1.27 |
1.4 |
0.23-0.32 |
0.38-0.40 |
0.4-0.9
|