Algengar SMD pakkningar

• Two-terminal packages
  • Rectangular passive components (mostly resistors and capacitors):
    • 01005 (0402 metric) : 0.016" × 0.008" (0.4 mm × 0.2 mm) Typical power rating for resistors 1/32 Watt
    • 0201 (0603 metric) : 0.024" × 0.012" (0.6 mm × 0.3 mm) Typical power rating for resistors 1/20 Watt
    • 0402 (1005 metric) : 0.04" × 0.02" (1.0 mm × 0.5 mm) Typical power rating for resistors 1/16 Watt
    • 0603 (1608 metric) : 0.063" × 0.031" (1.6 mm × 0.8 mm) Typical power rating for resistors 1/16 Watt
    • 0805 (2012 metric) : 0.08" × 0.05" (2.0 mm × 1.25 mm) Typical power rating for resistors 1/10 or 1/8 Watt
    • 1206 (3216 metric) : 0.126" × 0.063" (3.2 mm × 1.6 mm) Typical power rating for resistors 1/4 Watt
    • 1806 (4516 metric) : 0.177" × 0.063" (4.5 mm × 1.6 mm)
    • 1812 (4532 metric) : 0.18" × 0.12" (4.5 mm × 3.2 mm) Typical power rating for resistors 1/2 Watt
    • 2010 (5025 metric) : 0.2" × 0.1" (5.0 mm × 2.5 mm)
    • 2512 (6332 metric) : 0.25" × 0.12" (6.35 mm × 3.0 mm)
  • Tantalum capacitors [1]:
    • EIA 3216-12 (Kemet S, AVX S): 3.2 mm × 1.6 mm × 1.2 mm
    • EIA 3216-18 (Kemet A, AVX A): 3.2 mm × 1.6 mm × 1.8 mm
    • EIA 3528-12 (Kemet T, AVX T): 3.5 mm × 2.8 mm × 1.2 mm
    • EIA 3528-21 (Kemet B, AVX B): 3.5 mm × 2.8 mm × 2.1 mm
    • EIA 6032-15 (Kemet U, AVX W): 6.0 mm × 3.2 mm × 1.5 mm
    • EIA 6032-28 (Kemet C, AVX C): 6.0 mm × 3.2 mm × 2.8 mm
    • EIA 7260-38 (Kemet E, AVX V): 7.2 mm × 6.0 mm × 3.8 mm
    • EIA 7343-20 (Kemet V, AVX Y): 7.3 mm × 4.3 mm × 2.0 mm
    • EIA 7343-31 (Kemet D, AVX D): 7.3 mm × 4.3 mm × 3.1 mm
    • EIA 7343-43 (Kemet X, AVX E): 7.3 mm × 4.3 mm × 4.3 mm
  • SOD: Small Outline Diode
    • SOD-323: 1.7 × 1.25 × 0.95 mm
    • SOD-123: 3.68 × 1.17 × 1.60 mm
    • SOD-80C: 3.50mm × 1.50mm × More info [2]
  • MELF — Metal Electrode Leadless Face — (mostly resistors and diodes): Barrel shaped components, dimensions do not match those of rectangular references for identical codes.
    • MicroMelf (MMU) Size 0102: L:2.2mm D:1.1mm (solder pad fits rectangular 0805) 1/5 Watt (0.2W) 100V
    • MiniMelf (MMA) Size 0204: L:3.6mm D:1.4mm (solder pad fits rectangular 1206) 1/4 Watt (0.25W) 200V
    • Melf (MMB) Size 0207: L:5.8mm D:2.2mm 1 Watt (1.0W) 500V
• Three-terminal packages
  • SOT: small-outline transistor, with three terminals
    • SOT-23: 3 mm × 1.75 mm × 1.3 mm body - three terminals for a transistor, or up to eight terminals for an integrated circuit
    • SOT-223: 6.7 mm × 3.7 mm × 1.8 mm body - four terminals, one of which is a large heat-transfer pad
  • DPAK (TO-252): discrete packaging. Developed by Motorola to house higher powered devices. Comes in three- or five-terminal versions [3]
  • D2PAK (TO-263) - bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions [4]
  • D3PAK (TO-268) - even larger than D2PAK [5]
• Packages with four or more terminals (drawings of most of the following packages can be found on [6])
  • Dual-in-line
    • Small-outline integrated circuit (SOIC) - small-outline integrated circuit, dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm
    • J-Leaded Small Outline Package (SOJ) - the same as SOIC except J-leaded [7]
    • TSOP - thin small-outline package, thinner than SOIC with smaller pin spacing of 0.5 mm
    • SSOP - Shrink Small-Outline Package, pin spacing of 0.635 mm or in some cases 0.8mm
    • TSSOP - Thin Shrink Small-Outline package.
    • QSOP - Quarter-Size Small-Outline package, with pin spacing of 0.635 mm
    • VSOP - Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
  • Quad-in-line
    • PLCC - plastic leaded chip carrier, square, J-lead, pin spacing 1.27 mm
    • QFP - Quad Flat Package, various sizes, with pins on all four sides
    • LQFP - Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
    • PQFP - plastic quad flat-pack, a square with pins on all four sides, 44 or more pins
    • CQFP - ceramic quad flat-pack, similar to PQFP
    • MQFP - Metric Quad Flat Pack, a QFP package with metric pin distribution
    • TQFP - thin quad flat pack, a thinner version of PQFP
    • QFN - quad flat pack, no-leads, smaller footprint than leaded equivalent
    • LCC - Leadless Chip Carrier, contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
    • MLP - Leadframe package with a 0.5 mm contact pitch, no leads [8]
    • PQFN - power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking
  • Grid arrays
    • PGA - Pin grid array.
    • BGA - ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
    • LGA - Same Manufacture process of BGA, has Advantage being cooler than BGA by quick Heat Deception feature. No Balls only Patch.
    • FBGA - fine pitch ball grid array, with a square or rectangular array of solder balls on one surface
    • LFBGA - low profile fine pitch ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
    • TFBGA - thin fine pitch ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
    • CGA - column grid array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
    • CCGA - ceramic column grid array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
    • μBGA - micro-BGA, with ball spacing less than 1 mm
    • LLP - Lead Less Package, a package with metric pin distribution (0.5 mm pitch).
  • Non-packaged devices (although surface mount, these devices require specific process for assembly):
    • COB - chip-on-board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package (usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
    • COF - chip-on-flex; a variation of COB, where a chip is mounted directly to a flex circuit.
    • COG - chip-on-glass; a variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD.