Good Vs. Bad Soldering: Difference between revisions
		
		
		
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| *When [[Soldering]] you should pay close attention not to ruin the circuit board: | |||
| ==Good Soldering Should...== | ==Good Soldering Should...== | ||
| [[image:P1140132.jpg|175px|thumb|right|A large glob sitting  | [[image:P1140132.jpg|175px|thumb|right|A large glob sitting on top of the bit, leaving it unconnected to the copper and easily able to fall off. Additionally, below the glob exists a soldering bridge connecting 2 pieces of copper.]] | ||
| *Be shiny thus making it less sponge like and more conductive. | *Be shiny thus making it less sponge like and more conductive. | ||
| *Be underneath the component and not all over it, ensuring it is connected to the copper and not just sitting in a glob. | *Be underneath the component and not all over it, ensuring it is connected to the copper and not just sitting in a glob. | ||
| *Not be a giant glob on the top of the component, not connected to the copper.                                                                                                                   | *Not be a giant glob on the top of the component, not connected to the copper.                                                                                                                   | ||
| *Be very thin so that when heated it will not melt and spread. [[image:P1140121.jpg|175px|thumb| | *Be very thin so that when heated it will not melt and spread. [[image:P1140121.jpg|175px|thumb|right|Smooth and thin layer soldered perfectly onto the copper.]] | ||
| *Be small enough so that the clamp is able to clamp directly onto the legs of the component with no troubles from the solder. [[image:P1140126.jpg|175px|thumb|right| | *Be small enough so that the clamp is able to clamp directly onto the legs of the component with no troubles from the solder.   | ||
| [[image:P1140126.jpg|175px|thumb|right|Too much solder on component legs will get in the way of making good connections with the programming clip, shown here.]] | |||
| ==Good Soldering Should Not...== | ==Good Soldering Should Not...== | ||
| *Be a dull color making it more sponge like and full of holes and harder for electricity to pass through. [[image:P1140119.jpg|175px|thumb| | *Be a dull color making it more sponge like and full of holes and harder for electricity to pass through. [[image:P1140119.jpg|175px|thumb|right|A dull, not shiny blob sitting on top of the component.]] | ||
| *Be soldered onto the top of the component, stopping it from connecting to the copper. | *Be soldered onto the top of the component, stopping it from connecting to the copper. | ||
| *Be very thick, making it more likely to melt and spread wherever it pleases when heated. | *Be very thick, making it more likely to melt and spread wherever it pleases when heated. | ||
| *Run over the edges of the copper connecting two  | *Run over the edges of the copper connecting two [[copper trace|traces]] and shorting out the circuit board. | ||
| *Form a bridge between copper  | *Form a bridge between [[copper trace|copper traces]], shorting out the board. | ||
| *Leave bits of solder lying in random places all over the board. [[image:P1140116.jpg|175px|thumb|right|Bad soldering with burnt, and raised components and solder strewn across in all sorts of unnecessary places.]] | *Leave bits of solder lying in random places all over the board. [[image:P1140116.jpg|175px|thumb|right|Bad soldering with burnt, and raised components and solder strewn across in all sorts of unnecessary places.]] | ||
| *Burn the components you are trying to solder on. | *Burn the components you are trying to solder on. | ||
| *Be so underneath as to cause the component to raise up high off of the circuit board. | *Be so underneath as to cause the component to raise up high off of the circuit board. | ||
| [[Category:Circuits]] | [[Category:Tutorials]] [[Category:Circuits]] | ||
Latest revision as of 13:00, 14 August 2014
- When Soldering you should pay close attention not to ruin the circuit board:
Good Soldering Should...

- Be shiny thus making it less sponge like and more conductive.
- Be underneath the component and not all over it, ensuring it is connected to the copper and not just sitting in a glob.
- Not be a giant glob on the top of the component, not connected to the copper.
- Be very thin so that when heated it will not melt and spread.  Smooth and thin layer soldered perfectly onto the copper. 
- Be small enough so that the clamp is able to clamp directly onto the legs of the component with no troubles from the solder.

Good Soldering Should Not...
- Be a dull color making it more sponge like and full of holes and harder for electricity to pass through.  A dull, not shiny blob sitting on top of the component. 
- Be soldered onto the top of the component, stopping it from connecting to the copper.
- Be very thick, making it more likely to melt and spread wherever it pleases when heated.
- Run over the edges of the copper connecting two traces and shorting out the circuit board.
- Form a bridge between copper traces, shorting out the board.
- Leave bits of solder lying in random places all over the board.  Bad soldering with burnt, and raised components and solder strewn across in all sorts of unnecessary places. 
- Burn the components you are trying to solder on.
- Be so underneath as to cause the component to raise up high off of the circuit board.