Soldering

From Fab Lab Wiki - by NMÍ Kvikan
Revision as of 10:09, 15 January 2010 by Gísli (Talk | contribs)

Jump to: navigation, search

Use right heat for soldering.

Before you solder the components, you should clean your board or use flux (or both ,witch is really good).

We are soldering to make the components combined to the circuit board.


We want to have everything shiny.

For more information on good soldering and bad soldering go here.


We have different types of methods.

  • Method 1 - Pin by pin
  • Method 2 - Flood and suck
  • Method 3 - Solder paste
  • Desoldering SMD

Steps

  • Tape down the board
  • Heat the iron to around 640-740 fahrenheit = 340 celsius - 400 celsius , ( depends of what kind of solder your using but we most common in the labs is this heat.
  • clean the board with A small towel with spritt ,notice that I said towel,thats because if you use tissue paper your circuit board is always going to wana ripp the tissue and leave tissue particlas left on your board, the reason for this is if there is some fat or water particles on the board the solder will not combine as well or not all.
  • start shiny-ing the soldering iron with heating it up and coating it with solder.
  • There are many methods to solder as I already amentioned and it's you! that is going to find out what fits you the best.
           *Keep in mind*


-You want to use as little tin as possible. -You want to make it flow under the pins on the componement's,not over them. -you want to make it shiny ,witch means litle ammount of solder and do not heat it to much because if you do you are going to make the solder gray and messy.the main reason for that is because if it's gray and messy it is not going to lead the electric well. -You dont want airbubbles in your solder and the thing that is going to prevend air coming in it while your soldering is the "flux" witch is inside the tin we are yousing in the lab.Notice that the flux is not going to work aswell if its heated to much.