Good Vs. Bad Soldering
From Fab Lab Wiki - by NMÍ Kvikan
- When Soldering you should pay close attention not to ruin the circuit board:
Good Soldering Should...
- Be shiny thus making it less sponge like and more conductive.
- Be underneath the component and not all over it, ensuring it is connected to the copper and not just sitting in a glob.
- Not be a giant glob on the top of the component, not connected to the copper.
- Be very thin so that when heated it will not melt and spread.
- Be small enough so that the clamp is able to clamp directly onto the legs of the component with no troubles from the solder.
Good Soldering Should Not...
- Be a dull color making it more sponge like and full of holes and harder for electricity to pass through.
- Be soldered onto the top of the component, stopping it from connecting to the copper.
- Be very thick, making it more likely to melt and spread wherever it pleases when heated.
- Run over the edges of the copper connecting two traces and shorting out the circuit board.
- Form a bridge between copper traces, shorting out the board.
- Leave bits of solder lying in random places all over the board.
- Burn the components you are trying to solder on.
- Be so underneath as to cause the component to raise up high off of the circuit board.